半田

(2023 結果)

はんだは、金属表面を互いに接合するために使用される金属合金です。種類は、棒はんだ、リボンはんだ、はんだペースト、はんだショット、はんだ球、または線はんだで、直径は 0.006 インチ (0.15 mm) ~ 0.250 インチ (6.35 mm) で、融点は 118 °C (244 °F) です。 ) 鉛フリーまたは有鉛で 1983°F (1084°C) まで。フラックスのタイプは、酸性コア、洗浄不要、ロジン活性化、ロジン弱活性化、または水溶性です。

一部 # メーカー 説明 可用性 価格
Chip Quik, Inc. LF SOLDER WIRE 99.3/0.7 TIN/COPP
3
-
Chip Quik, Inc. LF SOLDER WIRE 99.3/0.7 TIN/COPP
4
-
Chip Quik, Inc. LF SOLDER WIRE 99.3/0.7 TIN/COPP
8
-
Chip Quik, Inc. LF SOLDER WIRE 99.3/0.7 TIN/COPP
9
-
Chip Quik, Inc. LF SOLDER WIRE 99.3/0.7 TIN/COPP
7
-
Chip Quik, Inc. LF SOLDER WIRE 99.3/0.7 TIN/COPP
8
-
Chip Quik, Inc. LF SOLDER WIRE 99.3/0.7 TIN/COPP
4
-
Chip Quik, Inc. SOLDER SPHERES SN63/PB37 .008" (
14
-
Chip Quik, Inc._SMD2150

SMD2150

Solder
Chip Quik, Inc. SOLDER SPHERES SN63/PB37 .010" (
3
-
Chip Quik, Inc. SOLDER SPHERES SN63/PB37 .014" (
9
-
Chip Quik, Inc._SMD2195

SMD2195

Solder
Chip Quik, Inc. SOLDER SPHERES SN63/PB37 .022" (
2
-
Chip Quik, Inc. SOLDER SPHERES SN63/PB37 .022" (
25
-
Chip Quik, Inc._SMD2020

SMD2020

Solder
Chip Quik, Inc. SOLDER SPHERES SN96.5/AG3.0/CU0.
3
-
Chip Quik, Inc._SMD2032

SMD2032

Solder
Chip Quik, Inc. SOLDER SPHERES SN96.5/AG3.0/CU0.
5
-
Chip Quik, Inc. SOLDER SPHERES SN96.5/AG3.0/CU0.
1
-
Chip Quik, Inc._SMD2036

SMD2036

Solder
Chip Quik, Inc. SOLDER SPHERES SN96.5/AG3.0/CU0.
3
-
Chip Quik, Inc. SOLDER SPHERES SN96.5/AG3.0/CU0.
4
-
Chip Quik, Inc._RASW.020 1OZ
Chip Quik, Inc. SOLDER WIRE 63/37 TIN/LEAD ROSIN
21
-
Chip Quik, Inc._RASW.031 1OZ
Chip Quik, Inc. SOLDER WIRE 63/37 TIN/LEAD ROSIN
22
-
Chip Quik, Inc._RASW.031 8OZ
Chip Quik, Inc. SOLDER WIRE 63/37 TIN/LEAD ROSIN
7
-
Chip Quik, Inc. LF SOLDER WIRE 96.5/3/0.5 TIN/SI
9
-
Chip Quik, Inc. LF SOLDER WIRE 96.5/3/0.5 TIN/SI
17
-
Chip Quik, Inc. LF SOLDER WIRE POCKET PACK 96.5/
8
-
Chip Quik, Inc. LF SOLDER WIRE 96.5/3/0.5 TIN/SI
14
-
Chip Quik, Inc. LF SOLDER WIRE 96.5/3/0.5 TIN/SI
7
-